Products & Solutions

Our Markets

Electronics & Telecommunication

The innovative strength of Evonik is indispensable in the Electronics & Telecommunication market. Our portfolio extends from active oxygens as photo resistant removal, wet cleaning and copper etchant in semiconductors, catalysts, epoxy curing agents, monomers and polyisocyanates, polymers for cable insulation, silica as antiblocking agents in the polymerization process to silanes working as adhesion promoters and coupling agents. As a leading global specialty chemicals group, we connect innovation with the needs of our customers to provide the best solutions.

Products & Solutions for Electronics & Telecommunication  

Active Oxygens for Electronics

Hydrogen peroxide is used as photo resistant removal, wet cleaning and copper etchant in semiconductors, circuit boards, display and LED applications for analog, digital and electricity devices and memory products. Persulfates are used for the cleaning and micro etching of PCBs and as oxidizing agents in plating and coating processes.

Adhesives for Electronics

Our solutions for the electronics industry range from thermal management additives that enhance the performance of electronic applications to specialty additives improving polymer electronic performance, flame retardancy and heat transfer in electronic applications.

Catalysts for Electronics

Substituted cyclohexanones are important intermediates for LCDs and can be synthesized by hydrogenation of phenol. Our palladium-on-carbon catalysts enable this reaction in a highly selective process. Our catalysts are characterized by the high purity of the noble metals and excellent batch-to-batch consistency. The closed loop service we offer for precious metal recovery makes them both sustainable and cost efficient. 

COMPIMIDE® Bismaleimides Resins

For the production of high-performance composites, adhesives and moldings.

DYNASYLAN® for Cables

DYNASYLAN® silanes act as adhesion promoters and coupling agent for highly filled compounds and grafting & crosslinking additives for grafted polyethylene (PEg) resulting in PEX pipes or XLPE cables. They allow for high filler-loading levels in halogen-free flame retardant (HFFR) compounds with good melt processability and improved physical properties.

DYNASYLAN® SILBOND for semiconductors

Ethyl silicate, the common name for tetra ethyl ortho silicate (TEOS), can be vaporized and thermally decomposed upon the surfaces of semiconductor chips. It forms electrically insulating layers of silica glass which are necessary in the fabrication of integrated circuits.

DYNASYLAN® SILFIN for the wire & cable industry  

Adhesion promoters and coupling agents for highly filled compounds. Ready-to-use, easy to dose liquid products and tailor-made blends consisting of all necessary ingredients for grafting and crosslinking of polyethene resulting in crosslinked polyethylene (PEX/XLPE).

Epoxy Curing Agents and Modifiers for Adhesive and Sealants  

Ancamine, Ancamide, Amicure, Curezol, Dicyanex and Imicure enable adhesive bonding of different substrates providing higher strength and flexibility. For one component systems (1K) and two component systems (2K) we offer polyamides, amidoamines, curing agents, accelerators, diluents, dicyandiamide (DICY) and more.

Insulation in semiconductor components

Coatings with P84® polyimide solutions are characterized by high dielectric strength at very thin layer thicknesses.

Monomers and Polyisocyanates for Polyurethane Coatings

VESTANAT® contains aliphatic and cycloaliphatic diisocyanate monomers for light stable PU resins and elastomers, waterborne polyurethane dispersions as well as cycloaliphatic polyisocyanates for durable polyurethane coatings.

May it be building blocks for resin synthesis, hardeners for 2K coatings or blocked systems for 1K applications we have the right solution for can coatings, artificial leather, OEM clear coats as well as wood coatings and plastic coatings. We offer IPDI, H12MDI, TMDI, T1890 and more.

Performance Intermediates for electronics

Intermediates from help manufacturers of electronic products to develop new solutions for their needs - such as DRIVOSOL® as a natural refrigerant in refrigerators, or our materials for the rubber and plastics market that can be used in equipment parts.

Plastic Additives for Cable & Electronics

From polymer electronical performance, to flame resistance and heat transfer, our portfolio meets all the demands of these cable and electronics applications.

Plastics for Cable Protection

VESTAMID® polyamide, VESTAKEEP® PEEK and VESTODUR® PBT used in sheathing or in cable protection tubing have protected cables for years. Continuous improvements let them always be the material of choice for the electronics and cable industry.

Polymers for Cable Insulation

Our polymers for the electronics industry can be used for cable insulation such as cable filling compounds and jelly compounds.

Polymers for Electronic Applications

We offer tailor-made polyesters, amorphous poly-alpha-olefins and liquid polybutadienes for potting compounds for electronics and cable insulation. Our range of products also covers polyester-based adhesives for electronics such as flexible flat cables.

ROHACELL® for Antennas and Radomes

Are you looking for a material for dielectric applications that combines the RF transparency of air with unrivalled processing performance at up to 190 °C (374 °F) and superior mechanical properties? Look no further: ROHACELL® rigid foam is doing the trick!

Silica for Electronics

Silica serves as antiblocking agents in the polymerization process or as additives for rheology control in circuit board production.

Silica in Illuminants

Silica effectively act as a chemistry binder in the phosphor layer of fluorescent lamps and prevent mercury pollution. Thus, the service life of fluorescent lamps is extended. In LED lamps, our silica is used as diffusion particles in LED silicon lenses.


Ultrahigh purity hexachlorodisilane used in the semiconductor industry for chemical vapor deposition (CVD) of silicon-containing films on silicon wafers at very low temperatures. Ultrahigh purity hexachlorodisilane is mainly used in the manufacture of next generation memory chips with the highest storage densities.

SIRIDION® TCS for optical fibers

Siridion® ultrahigh purity silicon tetrachloride is the key feedstock in optical fiber production. It is also used in the manufacture of polycrystalline silicon for the semiconductor and photovoltaics industries, and in the production of synthetic fused quartz glass.

VESTAKEEP® for ESD protection

Small electronic devices require narrower semiconductor fabrication. They need to occupy smaller spaces and perform better. But this leads to a critical challenge in processing: damage from electrostatic discharges (ESDs). Use our VESTAKEEP ® PEEK portfolio for ESD shielding.

How our products work

In the semiconductor industry, PERTRONIC® hydrogen peroxide plays an integral role in the integrated circuit manufacturing process. In the front-end-of-line, it is primarily used as an oxidizing agent in critical wafer cleaning and surface conditioning steps in transistor formation, copper/ULK dual-damascene formation, and post-CMP cleaning applications. In the back-end-of-line, hydrogen peroxide is used as an oxidizer in cleaning and surface conditioning applications related to 2.5D and 3D packaging applications, and as an etchant in the production of printed circuit boards. 

Another product for the semiconductor industry is ultrahigh purity hexachlorodisilane that can be used in the manufacture of next generation memory chips. Silicon tetrachloride also plays a huge role in the manufacture of polycrystalline silicon for the semiconductor industry. In addition, Evonik offers a product for the surfaces of semiconductor chips. When vaporized and thermally decomposed upon the surfaces of semiconductor chips, ethyl silicate forms electrically insulating layers of silica glass which are necessary in the fabrication of integrated circuits. 

Light-emitting diodes (LED) and fluorescent lamps are currently considered the top choice for lighting – especially given sustainability considerations. Fumed aluminum oxide (AEROXIDE®) and fumed silica (AEROSIL®) from Evonik really come into their own here, as strong binding agents or substrates in fluorescent lamps. You benefit in the production of premium illuminants: The specialized products offer you functions that are very difficult to achieve with other substances. 

For example, AEROXIDE® particles work extremely effectively as binding agents in the phosphorus layer of fluorescent lamps, preventing mercury from penetrating the protective layer of the glass tubes, where it can impair the illumination quality. An effective mercury barrier layer thus increases the life span of fluorescent lamps, while also reducing energy costs. 

Cable filling based on VESTOPLAST® offers excellent waterproofing properties along with a very good flexibility at low temperatures. VESTOPLAST® can modify cable jellies and thus help to prevent the cables from mechanical stress. Moreover, the environmentally neutral compositions are plasticizer- and VOC-free, strongly hydrophobic and resistant to chemicals and microorganisms. The formulations provide high dielectric breakdown voltage but do not attack plastic casings or cable sheathings. POLYVEST® is inert towards metals and alloys. 

Epoxy is well-suited for electronics because of its temperature resistance and high strength. Our Ancamine®, Dicyanex®, Imicure® and Curezol products find their applications particularly in battery sealants, magnet bonding and electronics manufacture.